Knowledge centre

Knowledge

Clear guidance on alloy selection, solder paste defects, pot maintenance and wire selection — with decision tables and shop-floor steps engineers can use immediately.

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From selection to troubleshooting

Based on STAR.I product data, industry standards and common process issues. Confirm parameters against the product TDS, equipment and reliability validation.

Solder bars for wave soldering
Troubleshooting

Excess Dross in Lead-Free Wave Soldering: Causes and Control

Analyse dross in lead-free wave soldering: pot temperature, flux, alloy, impurities, equipment and operation, plus high-antioxidant and high-temperature bar selection.

15 October 2026 9 min read
SICAL flux and electronic chemical containers
Selection guide

How to Choose a Flux: R vs RMA vs RA, No-Clean and Water-Soluble

Choose flux by activity level, cleaning method, solids content and process fit for wave, hand and SMT soldering, with key indicators, common mistakes and a validation checklist.

12 October 2026 9 min read
Lead-free solder wire on blue spools
Selection guide

Solder Wire Selection: Diameter, Flux Type and Core Count

Choose solder wire by alloy, flux type, single/three-core construction and diameter. Includes 0.3–1.2 mm diameter guidance and practical hand-soldering recommendations.

8 October 2026 8 min read
Solder bars for wave soldering
Equipment maintenance

Solder Bar & Pot Maintenance: Pure Tin Addition and Dross Control

Why tin content drops in a solder pot, how to calculate pure tin additions with T = W × (A − B) ÷ (100 − A), and how to control dross with high-antioxidant and high-temperature solder bars.

2 October 2026 10 min read
SMT lead-free solder paste jars
Troubleshooting

Solder Paste Printing & Reflow Defects: Causes and Solutions

Troubleshooting guide for solder paste defects: incomplete release, slumping, solder balls, bridging, tombstoning, insufficient solder, voids and dull joints.

25 September 2026 12 min read
Lead-free solder wire spools and packaging box
Selection guide

How to Choose a Lead-Free Solder Alloy: SAC305 vs Sn-Cu vs Sn-Cu-Ni-Ce

Compare SAC305, Sn-Cu0.7, Sn-Cu-Ni-Ce and low-temperature alloys by process, melting point, wetting, reliability and cost, with selection guidance.

18 September 2026 9 min read

Need product-specific selection advice?

These articles give general methods. Actual selection also depends on PCB finish, component limits, capacity and reliability requirements. Send us your process details.

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The product centre covers lead-free solder, paste, wire, bars, solder materials and SICAL electronic chemicals.

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Tell us your soldering method, alloy, product form and capacity. STAR.I’s technical team will help narrow the selection and provide samples and technical data.