Frequently Asked Questions

STAR.I was founded in 1999. The group includes Xingzhidao Technology Electronic and Xingzhidao Solder Material Production Co., Ltd., covering R&D, production and sales of solder products and electronic chemicals.

The main products are lead-free solder, solder paste, solder bars, solder wire, electroplating anodes, tin-plated copper wire and alloy wire, plus SICAL-brand flux, cleaners, thinners, SMT adhesive, antioxidant powder, dross reducer and lead-free solder paste.

The company operates an ISO 9001 quality management system (the brochure shows ISO9001:2008). Products are stated to meet GB 3131, GB 8012, JIS Z 3283 and QQ-S-571E, and lead-free products are SGS-tested. Request current certificates and reports from the sales team.

SICAL TECHNOLOGY is STAR.I’s electronic chemicals brand, focused on R&D and production of flux, solder paste, cleaners, SMT adhesive, antioxidants, dross reducers and lead-free soldering materials.

Lead is controlled below 1000 ppm (0.1 wt%) and cadmium below 20 ppm in the lead-free series. RoHS compliance is assessed at homogeneous-material level; confirm with the latest regulations and batch reports.

Common alloys include Sn-Ag-Cu (SAC305, about 217–220°C), Sn-Cu0.7 (about 227°C), Sn-Cu-Ni-Ce (about 227°C), Sn-58Bi (about 138°C) and Sn-50In (about 117–125°C). See the lead-free solder page for the full table.

SMT reflow typically uses solder paste; wave and hot-dip soldering use solder bars; hand soldering and rework use solder wire. The same alloy can be supplied in different forms, and the final choice depends on melting point, flux and process window.

Standard diameters are 0.3, 0.5, 0.6, 0.8, 1.0 and 1.2 mm, with 0.3–0.5 mm customizable. Flux options include rosin (R/RMA/RA), no-clean and water-soluble, in single-core or three-core construction.

Store sealed at 5–10°C and do not freeze. Warm at room temperature for 4–6 hours without opening, then mix in one direction for 1–3 minutes. Reseal unused paste and keep it at room temperature; do not return it to the refrigerator.

Maintain 18–24°C and 40–50% RH, avoiding direct airflow. Stencil printing viscosity is about 450,000–700,000 CPS; screen printing about 750,000–1,300,000 CPS.

Lead-free paste typically melts at 217–221°C, so the peak must be above the melting point. Set it according to the alloy, PCB thickness, component limits and paste datasheet; nitrogen is recommended to reduce oxidation.

Use T = W × (A − B) ÷ (100 − A). For a 500 kg pot at 63% specified tin and 61.5% measured tin, add about 20.3 kg of pure tin. Confirm with spectrometer results and re-check after mixing.

Check paste condition, stencil and printing parameters, placement accuracy, reflow profile and material oxidation. See the technical article “Solder Paste Printing & Reflow Defects: Causes and Solutions” for a detailed table.

Price, MOQ and lead time depend on alloy, product form, quantity and destination. Send the model, quantity and process details by phone or the inquiry form for a formal quotation.

Yes. Special-purpose fluxes can be developed, 0.3–0.5 mm wire diameters can be customized, and alloy wire can be made to customer dimensions and models. Provide the application, process requirements and samples before volume orders.

STAR.I engineers can provide on-site technical guidance, discuss application issues and offer system-level technical solutions and after-sales service. Products can also be modified for specific customer requirements.

Block B, No.3 One Road, Shangxue Industry Area, Jihua Road, Longgang, Shenzhen, China. Solder materials: +86-755-33823300; technology: +86-755-28573260; email: info@szxzd.com.

Run application trials with chemicals before volume use and select the best-matched, optimized process. For solder materials, perform a pilot batch and joint reliability validation.