Products

Products

From lead-free solder, paste, wire and bars to electroplating anodes, tin-plated copper wire and SICAL electronic chemicals — covering SMT reflow, wave, hand soldering and cleaning.

Selection guide

Product forms by soldering process

Selecting a solder product form by process
Process Typical form Typical alloy Notes
SMT reflow Solder paste SAC305, Sn-Cu Stencil printing and reflow; match stencil, profile and cleaning method
Wave / hot-dip Solder bar Sn-Cu-Ni-Ce, Sn-Cu0.7 Control pot temperature, composition and dross; test tin content regularly
Hand / iron soldering Solder wire SAC305, Sn-Cu0.7, Sn63Pb37 Choose diameter and flux type by joint size
Plating / component leads Anodes, tin-plated copper wire, alloy wire Lead-free and Sn-Pb series Confirm section shape, diameter and coating
SMT / wave support Flux, cleaner, thinner, SMT adhesive SICAL series Match activity, solids, cleaning method and process

General guidance only. Validate against the PCB finish, component temperature limits, reliability class and customer standard.

Need alloy and process guidance?

Share the soldering method, PCB finish, component temperature limits and target market. We can narrow the alloy range and provide samples and technical data.

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Looking for process parameters?

The knowledge centre covers alloy selection, paste defect troubleshooting, pot maintenance and solder wire selection.

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Need help selecting materials for your process?

Tell us your soldering method, alloy, product form and capacity. STAR.I’s technical team will help narrow the selection and provide samples and technical data.