<?xml version="1.0" encoding="UTF-8"?><rss version="2.0"><channel><title>星之岛科技技术知识</title><description>无铅焊锡、锡膏、焊锡条、锡线与电子化工材料的选型与工艺指南。</description><link>https://www.szxzd.com/</link><language>zh-CN</language><item><title>无铅波峰焊锡渣多怎么办？温度、助焊剂与抗氧化锡棒</title><link>https://www.szxzd.com/knowledge/wave-soldering-dross/</link><guid isPermaLink="true">https://www.szxzd.com/knowledge/wave-soldering-dross/</guid><description>从锡炉温度、助焊剂、合金与杂质、设备与操作五个方面分析无铅波峰焊锡渣产生的原因，并给出降低锡渣的操作建议与高抗氧化/高温锡棒的选用方法。</description><pubDate>Thu, 15 Oct 2026 00:00:00 GMT</pubDate><category>工艺排错</category><author>info@szxzd.com</author></item><item><title>助焊剂怎么选？R、RMA、RA 与免清洗/水溶性对比</title><link>https://www.szxzd.com/knowledge/flux-selection/</link><guid isPermaLink="true">https://www.szxzd.com/knowledge/flux-selection/</guid><description>从活性等级、清洗方式、固含量与工艺匹配四个维度，说明波峰焊、手工焊与 SMT 场景下助焊剂的选型方法，并给出常见误区与验证清单。</description><pubDate>Mon, 12 Oct 2026 00:00:00 GMT</pubDate><category>选型指南</category><author>info@szxzd.com</author></item><item><title>锡线怎么选？线径、助焊剂类型与芯数详解</title><link>https://www.szxzd.com/knowledge/solder-wire-selection/</link><guid isPermaLink="true">https://www.szxzd.com/knowledge/solder-wire-selection/</guid><description>从合金、助焊剂类型、单芯/三芯结构与线径四个维度，说明手工焊与返修用锡线的选择方法，并给出 0.3–1.2mm 线径的适用场景与使用建议。</description><pubDate>Thu, 08 Oct 2026 00:00:00 GMT</pubDate><category>选型指南</category><author>info@szxzd.com</author></item><item><title>焊锡条使用与锡炉维护：纯锡添加量计算与出渣控制</title><link>https://www.szxzd.com/knowledge/solder-bar-pot-maintenance/</link><guid isPermaLink="true">https://www.szxzd.com/knowledge/solder-bar-pot-maintenance/</guid><description>焊锡条使用过程中锡含量为何下降？如何用 T = W × (A − B) ÷ (100 − A) 计算纯锡添加量？本文给出计算示例、锡炉维护步骤、出渣控制与高抗氧化/高温锡棒的选用建议。</description><pubDate>Fri, 02 Oct 2026 00:00:00 GMT</pubDate><category>设备维护</category><author>info@szxzd.com</author></item><item><title>锡膏印刷与回流焊常见缺陷：原因与解决方法</title><link>https://www.szxzd.com/knowledge/solder-paste-defects/</link><guid isPermaLink="true">https://www.szxzd.com/knowledge/solder-paste-defects/</guid><description>系统梳理锡膏印刷、贴片与回流焊阶段的常见缺陷，包括下网不完全、塌边、锡珠、连锡、立碑、少锡、针孔与焊点不光亮，并给出可执行的原因分析与解决措施。</description><pubDate>Fri, 25 Sep 2026 00:00:00 GMT</pubDate><category>工艺排错</category><author>info@szxzd.com</author></item><item><title>无铅焊锡合金怎么选？Sn-Ag-Cu、Sn-Cu 与 Sn-Cu-Ni-Ce 对比</title><link>https://www.szxzd.com/knowledge/lead-free-alloy-selection/</link><guid isPermaLink="true">https://www.szxzd.com/knowledge/lead-free-alloy-selection/</guid><description>从焊接工艺、熔点、润湿性、可靠性和成本五个维度，对比 SAC305、Sn-Cu0.7、Sn-Cu-Ni-Ce、Sn-58Bi 等常用无铅合金，并给出波峰焊、回流焊与手工焊的选型建议。</description><pubDate>Fri, 18 Sep 2026 00:00:00 GMT</pubDate><category>选型指南</category><author>info@szxzd.com</author></item></channel></rss>